This technology focuses on the challenges of poor plastic deformation and low yield in high-beryllium-content beryllium-copper alloys. Breakthroughs have been made in product composition, plastic deformation, and heat treatment, forming a preparation process for highberyllium-content beryllium-copper strips and micro-wires. These products serve as key raw materials for components such as photomultiplier tube dynodes and fuzz button connectors, It is of critical importance for the industrialization of materials used in electronic industrial components.

Technology provider:Xiangtan University